SEMICONDUCTOR DEVICE HAVING THERMOELECTRIC MODULE
A heat spreader is formed on a first semiconductor package and a second semiconductor package adjacent to the first semiconductor package, and first and second thermoelectric modules are included between the first and second semiconductor packages and the heat spreader. The first and second thermoel...
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Format | Patent |
Language | English |
Published |
05.03.2015
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Subjects | |
Online Access | Get full text |
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Abstract | A heat spreader is formed on a first semiconductor package and a second semiconductor package adjacent to the first semiconductor package, and first and second thermoelectric modules are included between the first and second semiconductor packages and the heat spreader. The first and second thermoelectric modules are formed to have opposite polarities, and the heat spreader heated by the first thermoelectric module is cooled due to activation of the second thermoelectric module. |
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AbstractList | A heat spreader is formed on a first semiconductor package and a second semiconductor package adjacent to the first semiconductor package, and first and second thermoelectric modules are included between the first and second semiconductor packages and the heat spreader. The first and second thermoelectric modules are formed to have opposite polarities, and the heat spreader heated by the first thermoelectric module is cooled due to activation of the second thermoelectric module. |
Author | IM YUN-HYEOK HYUN YOUNG-HOON KIM JIUL |
Author_xml | – fullname: KIM JIUL – fullname: HYUN YOUNG-HOON – fullname: IM YUN-HYEOK |
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Notes | Application Number: US201414302239 |
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PublicationDateYYYYMMDD | 2015-03-05 |
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PublicationYear | 2015 |
RelatedCompanies | SAMSUNG ELECTRONICS CO., LTD |
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Snippet | A heat spreader is formed on a first semiconductor package and a second semiconductor package adjacent to the first semiconductor package, and first and second... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | SEMICONDUCTOR DEVICE HAVING THERMOELECTRIC MODULE |
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