PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSTION, AND DRY FILM SOLDER RESIST

• Main Authors: CHOI BYUNG-JU, KU SE-JIN, JEONG WOO-JAE, LEE KWANG JOO, JEONG MIN-SU, CHOI BO-YUN
• Format: Patent
• Language: English
• Published: 12.02.2015
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified o...