On-Chip RF Shields with Backside Redistribution Lines

Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second reg...

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Bibliographic Details
Main Authors BEER GOTTFRIED, POHL JENS, KOERNER HEINRICH, BARTH HANS-JOACHIM
Format Patent
LanguageEnglish
Published 22.01.2015
Subjects
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