On-Chip RF Shields with Backside Redistribution Lines
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second reg...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
22.01.2015
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Subjects | |
Online Access | Get full text |
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