QUAD FLAT SEMICONDUCTOR DEVICE WITH ADDITIONAL CONTACTS

• Main Authors: IBRAHIM RUZAINI B, TIU KONG BEE, LO WAI YEW
• Format: Patent
• Language: English
• Published: 15.01.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A Quad Flat Package (QFP) semiconductor device has a multi-stepped lead frame for forming rows of external contacts. A semiconductor die is attached to a die pad of the lead frame and electrically connected to lead with bond wires. The die and bond wires are encapsulated with a mold compound and the...