Multilayer Chemical Mechanical Polishing Pad Stack With Soft And Conditionable Polishing Layer

A multilayer chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongati...

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Bibliographic Details
Main Authors HENDRON JEFFREY JAMES, NOWLAND JOHN G, JAMES DAVID B, MURNANE JAMES, DEGROOT MARTY W, JENSEN MICHELLE K, YEH FENGJI, QIAN BAINIAN
Format Patent
LanguageEnglish
Published 04.12.2014
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:A multilayer chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.
Bibliography:Application Number: US201313906825