EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE

• Main Authors: NIMKAR NITESH, CHEAH BOK ENG, OOI TOONG ERH
• Format: Patent
• Language: English
• Published: 02.10.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An apparatus including a die; and a build-up carrier including alternating layers of conductive material and dielectric material disposed on a device side of the die and dielectric material embedding a portion of a thickness dimension of the die; and a plurality of carrier contact points disposed at...