SEMICONDUCTOR GRID ARRAY PACKAGE

• Main Authors: LIM FUI YEE, YAP WENG FOONG
• Format: Patent
• Language: English
• Published: 21.08.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor grid array package has a first housing member with a cavity that has a cavity floor and cavity walls. A semiconductor die is affixed to the cavity floor. A second housing member is molded to the first housing member and covers an interface surface of the die. Electrically conductive...