THERMALLY DRIVEN WORKLOAD SCHEDULING IN A HETEROGENEOUS MULTI-PROCESSOR SYSTEM ON A CHIP

Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip ("SoC") are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may...

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Bibliographic Details
Main Authors ARTMEIER JAMES M, RYCHLIK BOHUSLAV, GUZZI MARK D, SUR SUMIT, MUELLER PHILIP T
Format Patent
LanguageEnglish
Published 03.07.2014
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip ("SoC") are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service ("QoS") by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
Bibliography:Application Number: US201414195976