METHOD FOR FORMING A COPPER WIRING PATTERN

• Main Authors: KUMASHIRO YASUSHI, NAKAKO HIDEO, MASUDA KATSUYUKI, YAMAMOTO KAZUNORI, EJIRI YOSHINORI, MACHII YOUICHI, YOKOZAWA SHUNYA
• Format: Patent
• Language: English
• Published: 07.11.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

There is provided a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used, but copper particles, which cause little electromigration and are small in the price rate of material itself...