PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD, AND DIE BONDER

• Main Authors: YODA MITSUO, OTAKE SHIGERU, OKUBO TATSUYUKI
• Format: Patent
• Language: English
• Published: 24.10.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A paste applying apparatus and method apply a paste within an application area. A drawing pattern is determined in advance, within the application area, for each of the application areas, and the drawing pattern has, at least, a first drawing route and a fifth drawing route for drawing in horizontal...