PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD, AND DIE BONDER

A paste applying apparatus and method apply a paste within an application area. A drawing pattern is determined in advance, within the application area, for each of the application areas, and the drawing pattern has, at least, a first drawing route and a fifth drawing route for drawing in horizontal...

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Main Authors YODA MITSUO, OTAKE SHIGERU, OKUBO TATSUYUKI
Format Patent
LanguageEnglish
Published 24.10.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A paste applying apparatus and method apply a paste within an application area. A drawing pattern is determined in advance, within the application area, for each of the application areas, and the drawing pattern has, at least, a first drawing route and a fifth drawing route for drawing in horizontal direction, a second drawing route and a fourth drawing route for drawing obliquely, and further a third drawing route, in vicinity of a side of the application area in the horizontal direction. A controller portion controls the discharge portion and the moving portion, so that the paste is applied, continuously, from a drawing start-point to a drawing end-point, which are determined in advance, through the first drawing route, the second drawing route, the third drawing route, the fourth drawing route and the fifth drawing route.
AbstractList A paste applying apparatus and method apply a paste within an application area. A drawing pattern is determined in advance, within the application area, for each of the application areas, and the drawing pattern has, at least, a first drawing route and a fifth drawing route for drawing in horizontal direction, a second drawing route and a fourth drawing route for drawing obliquely, and further a third drawing route, in vicinity of a side of the application area in the horizontal direction. A controller portion controls the discharge portion and the moving portion, so that the paste is applied, continuously, from a drawing start-point to a drawing end-point, which are determined in advance, through the first drawing route, the second drawing route, the third drawing route, the fourth drawing route and the fifth drawing route.
Author OTAKE SHIGERU
YODA MITSUO
OKUBO TATSUYUKI
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Snippet A paste applying apparatus and method apply a paste within an application area. A drawing pattern is determined in advance, within the application area, for...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD, AND DIE BONDER
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