PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD, AND DIE BONDER

A paste applying apparatus and method apply a paste within an application area. A drawing pattern is determined in advance, within the application area, for each of the application areas, and the drawing pattern has, at least, a first drawing route and a fifth drawing route for drawing in horizontal...

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Bibliographic Details
Main Authors YODA MITSUO, OTAKE SHIGERU, OKUBO TATSUYUKI
Format Patent
LanguageEnglish
Published 24.10.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A paste applying apparatus and method apply a paste within an application area. A drawing pattern is determined in advance, within the application area, for each of the application areas, and the drawing pattern has, at least, a first drawing route and a fifth drawing route for drawing in horizontal direction, a second drawing route and a fourth drawing route for drawing obliquely, and further a third drawing route, in vicinity of a side of the application area in the horizontal direction. A controller portion controls the discharge portion and the moving portion, so that the paste is applied, continuously, from a drawing start-point to a drawing end-point, which are determined in advance, through the first drawing route, the second drawing route, the third drawing route, the fourth drawing route and the fifth drawing route.
Bibliography:Application Number: US201213587103