THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD
A circuit board with an embedded thermoelectric device with hard thermal bonds. A method of embedding a thermoelectric device in a circuit board and forming hard thermal bonds.
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
01.08.2013
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Subjects | |
Online Access | Get full text |
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Summary: | A circuit board with an embedded thermoelectric device with hard thermal bonds. A method of embedding a thermoelectric device in a circuit board and forming hard thermal bonds. |
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Bibliography: | Application Number: US201313798805 |