APA (7th ed.) Citation

SHAONING, Y., KHENG, L. Y., KANG, L. Y., & BOON, T. J. (2013). TSV Backside Processing Using Copper Damascene Interconnect Technology.

Chicago Style (17th ed.) Citation

SHAONING, YUAN, LIM YEOW KHENG, LU YUE KANG, and TAN JUAN BOON. TSV Backside Processing Using Copper Damascene Interconnect Technology. 2013.

MLA (9th ed.) Citation

SHAONING, YUAN, et al. TSV Backside Processing Using Copper Damascene Interconnect Technology. 2013.