System and Method for Determining Thermal Management Policy From Leakage Current Measurement
Various embodiments of methods and systems for determining the thermal status of processing components within a portable computing device ("PCD") by measuring leakage current on power rails associated with the components are disclosed. One such method involves measuring current on a power...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
18.04.2013
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Subjects | |
Online Access | Get full text |
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Summary: | Various embodiments of methods and systems for determining the thermal status of processing components within a portable computing device ("PCD") by measuring leakage current on power rails associated with the components are disclosed. One such method involves measuring current on a power rail after a processing component has entered a "wait for interrupt" mode. Advantageously, because a processing component may "power down" in such a mode, any current remaining on the power rail associated with the processing component may be attributable to leakage current. Based on the measured leakage current, a thermal status of the processing component may be determined and thermal management policies consistent with the thermal status of the processing component implemented. Notably, it is an advantage of embodiments that the thermal status of a processing component within a PCD may be established without the need to leverage temperature sensors. |
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Bibliography: | Application Number: US201113301431 |