OVERLAY METROLOGY BY PUPIL PHASE ANALYSIS

The present invention may include measuring a first phase distribution across a pupil plane of a portion of illumination reflected from a first overlay target of a semiconductor wafer, wherein the first overlay target is fabricated to have a first intentional overlay, measuring a second phase distri...

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Main Authors ZAHARAN OFER, MANASSEN AMNON, LEVINSKI VLADIMIR, NEGRI DARIA, SELIGSON JOEL, SAPIENS NOAM, HILL ANDY, KANDEL DANIEL, BACHAR OHAD, BARUCH MOSHE
Format Patent
LanguageEnglish
Published 21.02.2013
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Summary:The present invention may include measuring a first phase distribution across a pupil plane of a portion of illumination reflected from a first overlay target of a semiconductor wafer, wherein the first overlay target is fabricated to have a first intentional overlay, measuring a second phase distribution across the pupil plane of a portion of illumination reflected from a second overlay target, wherein the second overlay target is fabricated to have a second intentional overlay in a direction opposite to and having the same magnitude as the first intentional overlay, determining a first phase tilt associated with a sum of the first and second phase distributions, determining a second phase tilt associated with a difference between the first and second phase distributions, calibrating a set of phase tilt data, and determining a test overlay value associated with the first and second overlay target.
Bibliography:Application Number: US201113209778