WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION
Methods, systems, and apparatuses for printing under bump metallization (UBM) features on chips/wafers are provided. A wafer is received that has a surface defined by a plurality of integrated circuit regions. Each integrated circuit region has a passivation layer and a plurality of terminals on the...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
27.09.2012
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Subjects | |
Online Access | Get full text |
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