WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

• Main Authors: LAW EDWARD, HU KUNZHONG (KEVIN)
• Format: Patent
• Language: English
• Published: 27.09.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods, systems, and apparatuses for printing under bump metallization (UBM) features on chips/wafers are provided. A wafer is received that has a surface defined by a plurality of integrated circuit regions. Each integrated circuit region has a passivation layer and a plurality of terminals on the...