WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Methods, systems, and apparatuses for printing under bump metallization (UBM) features on chips/wafers are provided. A wafer is received that has a surface defined by a plurality of integrated circuit regions. Each integrated circuit region has a passivation layer and a plurality of terminals on the...

Full description

Saved in:
Bibliographic Details
Main Authors LAW EDWARD, HU KUNZHONG (KEVIN)
Format Patent
LanguageEnglish
Published 27.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Methods, systems, and apparatuses for printing under bump metallization (UBM) features on chips/wafers are provided. A wafer is received that has a surface defined by a plurality of integrated circuit regions. Each integrated circuit region has a passivation layer and a plurality of terminals on the surface of the wafer accessible through openings in the passivation layer. A plurality of UBM features are formed on the surface of the wafer in the form of an ink such that each UBM feature is formed electrically coupled with a corresponding terminal of the plurality of terminals. An ink jet printer may be used to print the ink in the form of the UBM feature. A UBM feature may be formed directly on a corresponding terminal, or on routing that is coupled to the corresponding terminal. A bump interconnect may be formed on the UBM feature.
Bibliography:Application Number: US201213492397