WIRING BOARD

A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may include a conductor layer, a solder resist layer laminated thereon, and a conductor post provided at least within the through-hole and that is electrically connected to a conductor lay...

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Bibliographic Details
Main Authors SATO HIRONORI, HIGO KAZUNAGA, YAMADA ERINA
Format Patent
LanguageEnglish
Published 21.06.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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