METHOD AND ARRANGEMENT FOR COOLING A SUBSTRATE, ESPECIALLY A SEMICONDUCTOR

• Main Authors: ANGELIS WALTER GEORG, SEIDLER SIEGFRIED, LAUFER WOLFGANG
• Format: Patent
• Language: English
• Published: 29.12.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COLD ROOMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT PUMP SYSTEMS; HEATING; ICE-BOXES; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; PRINTED CIRCUITS; REFRIGERATION OR COOLING; REFRIGERATORS; SEMICONDUCTOR DEVICES; WEAPONS

In this method, a refrigerant (52) is compressed (32) in a refrigerating circuit, then condensed by cooling in a condenser (44), then expanded in a throttle valve (62) and delivered in the expanded state, in the form of wet vapor (52), to an evaporator (60) that is in thermally conductive contact with a substrate (12) to be cooled. The cooling process thus operates similarly to a liquid cooling process, but with a higher mean logarithmic heat transfer temperature difference, which allows lower temperatures of the substrate (12) to be achieved and makes possible a better heat transition coefficient, since the refrigerant is present as wet vapor. A corresponding arrangement is likewise described.