SIGNAL PATH INTERCONNECTION AND ASSEMBLY

Various embodiments are generally directed to an apparatus that provides an interconnection with efficient data signal throughput. In some embodiments, a controller printed circuit board (PCB) supports a controller integrated circuit (IC) and a support bracket. A memory PCB is supported by the suppo...

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Bibliographic Details
Main Authors GUNDERSON NEAL FRANK, LESTER NATHAN LOREN, PAVLAK, JR. RAYMOND, FARLING DUANE JAMES
Format Patent
LanguageEnglish
Published 01.09.2011
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:Various embodiments are generally directed to an apparatus that provides an interconnection with efficient data signal throughput. In some embodiments, a controller printed circuit board (PCB) supports a controller integrated circuit (IC) and a support bracket. A memory PCB is supported by the support bracket in a spaced apart, parallel relation to the controller PCB. The memory PCB supports at least one memory IC and has an edge connector which engages the support bracket. A flex circuit is provided that interconnects the edge connector to an interposer positioned on the controller PCB between the respective areal extent of the controller PCB and the memory PCB to form a data signal path between the memory IC and the controller IC.
Bibliography:Application Number: US20100715009