FABRICATION METHOD OF TWO-TERMINAL SEMICONDUCTOR COMPONENT USING TRENCH TECHNOLOGY

A method of fabricating a two-terminal semiconductor component using a trench technique is disclosed that includes forming a trench by etching an etching pattern formed on a substrate on which an active layer having impurities added is grown, forming a front metal layer on a front upper surface of t...

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Bibliographic Details
Main Authors KIM MI-RA, RHEE JIN-KOO, LEE SEONG-DAE, MIN DAE-HONG
Format Patent
LanguageEnglish
Published 10.03.2011
Subjects
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