FABRICATION METHOD OF TWO-TERMINAL SEMICONDUCTOR COMPONENT USING TRENCH TECHNOLOGY
A method of fabricating a two-terminal semiconductor component using a trench technique is disclosed that includes forming a trench by etching an etching pattern formed on a substrate on which an active layer having impurities added is grown, forming a front metal layer on a front upper surface of t...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
10.03.2011
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Subjects | |
Online Access | Get full text |
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