Housing Used As Heat Collector

A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting...

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Main Authors GOLDRIAN GOTTFRIED A, RIES MANFRED
Format Patent
LanguageEnglish
Published 20.01.2011
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Abstract A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.
AbstractList A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.
Author GOLDRIAN GOTTFRIED A
RIES MANFRED
Author_xml – fullname: GOLDRIAN GOTTFRIED A
– fullname: RIES MANFRED
BookMark eNrjYmDJy89L5WSQ88gvLc7MS1cILU5NUXAsVvBITSxRcM7PyUlNLskv4mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGhgaGxsZmxo6GxsSpAgAdQiZq
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2011013363A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2011013363A13
IEDL.DBID EVB
IngestDate Fri Jul 19 15:17:56 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2011013363A13
Notes Application Number: US20090502547
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110120&DB=EPODOC&CC=US&NR=2011013363A1
ParticipantIDs epo_espacenet_US2011013363A1
PublicationCentury 2000
PublicationDate 20110120
PublicationDateYYYYMMDD 2011-01-20
PublicationDate_xml – month: 01
  year: 2011
  text: 20110120
  day: 20
PublicationDecade 2010
PublicationYear 2011
RelatedCompanies INTERNATIONAL BUSINESS MACHINES CORPORATION
RelatedCompanies_xml – name: INTERNATIONAL BUSINESS MACHINES CORPORATION
Score 2.7929509
Snippet A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and...
SourceID epo
SourceType Open Access Repository
SubjectTerms CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Title Housing Used As Heat Collector
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110120&DB=EPODOC&locale=&CC=US&NR=2011013363A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR3bSsMw9DCm6N50Kl7mKCh9K1rTJvOhyJa2FGEX3Cp7G8maiiDbsBV_35PY6p72EkIOnFzgXHMuALcuo0ISnzmPUvQcT-bSEQwHtDWk6yslmel1OBzRJPWe5_68AR91LoypE_ptiiMiRS2R3kvDrzf_TqzQxFYWd_Idl9ZP8SwI7ax29-lcUDscBNFkHI65zXmQTu3RSwUjhJI-2kp7qEgzHQAWvQ50XspmW6jER7A_QXyr8hgaatWGQ173XmvDwbD68sZpRX3FCXSTtQ5Tf7PSQmVWv7ASZKSWMf216_0UbuJoxhMHN1r83WuRTrdPRc6giRa_OgeLLZnW82WeC9dT9EFk4p5mvqfbRzGl3Avo7MJ0uRt8Ba1fx6iLJNKBZvn5pa5Rspayax7kBwf2epM
link.rule.ids 230,309,783,888,25578,76884
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR3LSsNAcChVrDetitVaA0puQWMeWw9B2jyI2qTFJtJb2W02IkhbTMTfd3ZNtKdelmUHZh8wz50HwLVObMoMi2j3jPY1k-VMowQHtDWYbnHOiOx1GMV2mJpPM2vWgI86F0bWCf2WxRGRohZI76Xk1-t_J5YnYyuLG_aOS6uHIHE8NavdfSIXVPWGjj8Ze2NXdV0nnarxSwUzDNsYoK20g0p2X1Ta91-HIi9lvSlUggPYnSC-ZXkIDb5sQ8ute6-1YS-qvrxxWlFfcQS9cCXC1N-UtOCZMiiUEBmpIk1_4Xo_hqvAT9xQw43mf_eap9PNUxkn0ESLn5-CQhZE6Pksz6lucvuOZvTWzixTtI8inOsd6G7DdLYdfAmtMIlG89Fj_HwO-79OUh3JpQvN8vOLX6CULVlPPs4P7019gw
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Housing+Used+As+Heat+Collector&rft.inventor=GOLDRIAN+GOTTFRIED+A&rft.inventor=RIES+MANFRED&rft.date=2011-01-20&rft.externalDBID=A1&rft.externalDocID=US2011013363A1