METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE

• Main Authors: HARA TOMIHIRO, KIKUCHI NORIKO, KAWATE KOHICHIRO, SATO YOSHIAKI
• Format: Patent
• Language: English
• Published: 06.01.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.