Flexible Electronic Device and Method of Manufacture

• Main Authors: RUTMAN SERGE, JACOBSON JOSEPH M
• Format: Patent
• Language: English
• Published: 16.12.2010
• Subjects: ADVERTISING; ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION; BASIC ELECTRIC ELEMENTS; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; CRYPTOGRAPHY; CURRENT COLLECTORS; DISPLAY; EDUCATION; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; SEALS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

A flexible electronic device and method of manufacture are disclosed. According to one embodiment of the present invention, a flexible electronic device includes a front; a back; and a plurality of layers disposed between the front and the back. A plurality of components, including processor, a memory, a display, a display driver, a battery, and a data interface, may be disposed on the layers. The flexible electronic device may also include a plurality of flex points so that the flexible electronic device can be flexed relative to each flex point. According to another embodiment of the invention, the method of manufacturing a flexible electronic device by lamination includes (1) providing a first source of front layers for the flexible electronic device; (2) providing a second source of back layers for the flexible electronic device; (3) providing a source for each interior layer of the flexible electronic device, at least one interior layer having at least one flexible electronic component disposed thereon; (4) pressing the front, interior, and back layers together, resulting in a laminate; and (5) curing the laminate.