Method And Apparatus For Ultrasonic Bonding

• Main Authors: HESSE HANS-JUERGEN, BROEKELMANN MICHAEL, HAGENKOETTER SEBASTIAN
• Format: Patent
• Language: English
• Published: 04.11.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPUTING; COUNTING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method for quality control during ultrasonic bonding, in which a transducer bonding tool unit and an ultrasonic generator are used and in which, during the bonding, one or more sensors are used to sense measurement signals for one or more parameters, which can vary during the bonding, for assessing the bond quality and/or for influencing the bonding, and which proposes that, during the bonding, at least one speed profile measurement signal representing the time/speed profile of the tip of the ultrasonic tool in the direction of oscillation thereof be sensed. The invention also relates to a bonding apparatus which is suitable for carrying out the method. Furthermore, the invention relates to other quality control methods for ultrasonic bonding and to bonding apparatuses which are suitable for carrying out these methods.