Method And Apparatus For Ultrasonic Bonding

A method for quality control during ultrasonic bonding, in which a transducer bonding tool unit and an ultrasonic generator are used and in which, during the bonding, one or more sensors are used to sense measurement signals for one or more parameters, which can vary during the bonding, for assessin...

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Bibliographic Details
Main Authors HESSE HANS-JUERGEN, BROEKELMANN MICHAEL, HAGENKOETTER SEBASTIAN
Format Patent
LanguageEnglish
Published 04.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
CLADDING OR PLATING BY SOLDERING OR WELDING
COMPUTING
COUNTING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PHYSICS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method for quality control during ultrasonic bonding, in which a transducer bonding tool unit and an ultrasonic generator are used and in which, during the bonding, one or more sensors are used to sense measurement signals for one or more parameters, which can vary during the bonding, for assessing the bond quality and/or for influencing the bonding, and which proposes that, during the bonding, at least one speed profile measurement signal representing the time/speed profile of the tip of the ultrasonic tool in the direction of oscillation thereof be sensed. The invention also relates to a bonding apparatus which is suitable for carrying out the method. Furthermore, the invention relates to other quality control methods for ultrasonic bonding and to bonding apparatuses which are suitable for carrying out these methods.
Bibliography:Application Number: US20100778883