ABRASIVE COMPACTS

The invention is for a polycrystalline diamond abrasive compact comprising a primary polycrystalline diamond material of bonded diamond particles and a secondary polycrystalline diamond material interspersed through the primary polycrystalline diamond material or a region thereof. The invention is c...

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Bibliographic Details
Main Author TANK KLAUS
Format Patent
LanguageEnglish
Published 04.11.2010
Subjects
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:The invention is for a polycrystalline diamond abrasive compact comprising a primary polycrystalline diamond material of bonded diamond particles and a secondary polycrystalline diamond material interspersed through the primary polycrystalline diamond material or a region thereof. The invention is characterised in that the secondary polycrystalline diamond material comprises particulates or granules of thermally stable polycrystalline diamond material. The invention extends to an abrasive cutting element suitable for cutting or abrading a substrate or in drilling applications.
Bibliography:Application Number: US20080525945