APA (7th ed.) Citation

PATRICK, G., GREGORY, G., MATTHEW, S., HALE, J., & JAMES, H. (2010). APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS.

Chicago Style (17th ed.) Citation

PATRICK, GORUN, GEORGE GREGORY, STILES MATTHEW, JOHNSON HALE, and HERMANOWSKI JAMES. APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS. 2010.

MLA (9th ed.) Citation

PATRICK, GORUN, et al. APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS. 2010.