Molded flip chip package with enhanced mold-die adhesion
A molded flip chip package with enhanced adhesion between mold and die backside interface and the method of fabricating the package are described. The package is less prone to mold-die delamination. In an embodiment of the invention, the package has a die with a die frontside (die bottom side) attac...
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Main Author | |
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Format | Patent |
Language | English |
Published |
17.12.2009
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Subjects | |
Online Access | Get full text |
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Abstract | A molded flip chip package with enhanced adhesion between mold and die backside interface and the method of fabricating the package are described. The package is less prone to mold-die delamination. In an embodiment of the invention, the package has a die with a die frontside (die bottom side) attached to a substrate and a die backside (die top side). A first material is disposed on a portion of the die backside. A second material encapsulates the first material and the die backside. |
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AbstractList | A molded flip chip package with enhanced adhesion between mold and die backside interface and the method of fabricating the package are described. The package is less prone to mold-die delamination. In an embodiment of the invention, the package has a die with a die frontside (die bottom side) attached to a substrate and a die backside (die top side). A first material is disposed on a portion of the die backside. A second material encapsulates the first material and the die backside. |
Author | LOKE MUN LEONG |
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Snippet | A molded flip chip package with enhanced adhesion between mold and die backside interface and the method of fabricating the package are described. The package... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Molded flip chip package with enhanced mold-die adhesion |
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