Molded flip chip package with enhanced mold-die adhesion

A molded flip chip package with enhanced adhesion between mold and die backside interface and the method of fabricating the package are described. The package is less prone to mold-die delamination. In an embodiment of the invention, the package has a die with a die frontside (die bottom side) attac...

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Bibliographic Details
Main Author LOKE MUN LEONG
Format Patent
LanguageEnglish
Published 17.12.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A molded flip chip package with enhanced adhesion between mold and die backside interface and the method of fabricating the package are described. The package is less prone to mold-die delamination. In an embodiment of the invention, the package has a die with a die frontside (die bottom side) attached to a substrate and a die backside (die top side). A first material is disposed on a portion of the die backside. A second material encapsulates the first material and the die backside.
Bibliography:Application Number: US20080157818