Integrated circuit package including wire bonds

It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 mum or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the...

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Bibliographic Details
Main Authors OSENBACH JOHN WILLIAM, WEACHOCK RONALD JAMES, ANTOL JOZE EURA
Format Patent
LanguageEnglish
Published 16.04.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 mum or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion.
Bibliography:Application Number: US20070973859