HEADSET
Provided is a headset including a main housing and a speaker housing that are integrally formed with each other and a rear-side sound-leakage preventing section to shield sound emitted towards a rear side of a speaker. To this end, the headset includes a main housing integrally formed with a speaker...
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Main Author | |
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Format | Patent |
Language | English |
Published |
02.04.2009
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Subjects | |
Online Access | Get full text |
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Abstract | Provided is a headset including a main housing and a speaker housing that are integrally formed with each other and a rear-side sound-leakage preventing section to shield sound emitted towards a rear side of a speaker. To this end, the headset includes a main housing integrally formed with a speaker housing that protrudes from the main housing, at least one rear-side sound-leakage preventing unit engaged with an inner side of the speaker housing to shield sound emitted towards a rear side of a speaker, and a mounting unit to sequentially couple the speaker and the at least one rear-side sound-leakage preventing unit to the inner side of the speaker housing and mount the at least one rear-side sound-leakage preventing units in the inner side of the speaker housing. |
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AbstractList | Provided is a headset including a main housing and a speaker housing that are integrally formed with each other and a rear-side sound-leakage preventing section to shield sound emitted towards a rear side of a speaker. To this end, the headset includes a main housing integrally formed with a speaker housing that protrudes from the main housing, at least one rear-side sound-leakage preventing unit engaged with an inner side of the speaker housing to shield sound emitted towards a rear side of a speaker, and a mounting unit to sequentially couple the speaker and the at least one rear-side sound-leakage preventing unit to the inner side of the speaker housing and mount the at least one rear-side sound-leakage preventing units in the inner side of the speaker housing. |
Author | LEE GUN-WOO |
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Notes | Application Number: US20080174835 |
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PublicationDateYYYYMMDD | 2009-04-02 |
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PublicationYear | 2009 |
RelatedCompanies | SAMSUNG ELECTRONICS CO., LTD |
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Snippet | Provided is a headset including a main housing and a speaker housing that are integrally formed with each other and a rear-side sound-leakage preventing... |
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SubjectTerms | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS |
Title | HEADSET |
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