System and method for electroplating flexible substrates

A processing system for processing flexible substrates is disclosed. The system includes a loading station having an input spool adapted to support a wounded, unprocessed flexible substrate; a processing station adapted to perform one or more predetermined processes on the flexible substrate; an unl...

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Main Authors SOURIVONGS KAM, HARRIS JOHN S, NELSON BOYD, JACKSON DALE E
Format Patent
LanguageEnglish
Published 24.05.2007
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Abstract A processing system for processing flexible substrates is disclosed. The system includes a loading station having an input spool adapted to support a wounded, unprocessed flexible substrate; a processing station adapted to perform one or more predetermined processes on the flexible substrate; an unloading station having an output spool adapted to receive the processed flexible substrate; and a substrate stability subsystem adapted to maintain the flexible substrate in a substantially vertical orientation while the substrate undergoes the one or more processes performed by the processing station. The substrate stability subsystem includes movable upper clips adapted to engage with upper portions of the flexible substrate, and a plurality of lower clips adapted to engage with lower portions of the flexible substrate as it is being transported into and out of the processing station. Also disclosed is a unique shield for the cathode clips to improve the uniformity of the deposition formed on the flexible substrate, and a unique seal to allow the transportation of the lower clips into and out of the electroplating cell while reducing leakage of fluid from the cell.
AbstractList A processing system for processing flexible substrates is disclosed. The system includes a loading station having an input spool adapted to support a wounded, unprocessed flexible substrate; a processing station adapted to perform one or more predetermined processes on the flexible substrate; an unloading station having an output spool adapted to receive the processed flexible substrate; and a substrate stability subsystem adapted to maintain the flexible substrate in a substantially vertical orientation while the substrate undergoes the one or more processes performed by the processing station. The substrate stability subsystem includes movable upper clips adapted to engage with upper portions of the flexible substrate, and a plurality of lower clips adapted to engage with lower portions of the flexible substrate as it is being transported into and out of the processing station. Also disclosed is a unique shield for the cathode clips to improve the uniformity of the deposition formed on the flexible substrate, and a unique seal to allow the transportation of the lower clips into and out of the electroplating cell while reducing leakage of fluid from the cell.
Author HARRIS JOHN S
SOURIVONGS KAM
JACKSON DALE E
NELSON BOYD
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Snippet A processing system for processing flexible substrates is disclosed. The system includes a loading station having an input spool adapted to support a wounded,...
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SubjectTerms APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Title System and method for electroplating flexible substrates
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