Wafer level integration of multiple optical elements

Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lit...

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Bibliographic Details
Main Authors HARDEN BRIAN, FELDMAN MICHAEL, KATHMAN ALAN
Format Patent
LanguageEnglish
Published 17.05.2007
Subjects
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