Circuit board and circuit apparatus using the same

A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has the circuit board in which a metal s...

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Main Authors USUI RYOSUKE, SHIBATA KIYOSHI
Format Patent
LanguageEnglish
Published 01.03.2007
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Abstract A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has the circuit board in which a metal substrate having pierced holes is formed as a core member. Protrusions are formed at the top ends of the pierced holes, and round corners are formed at the bottom ends of the same. Insulating layers are formed on both sides of the metal substrate, and wiring pattern layers are formed on the respective insulating layers. The insulator formed on one side of the metal substrate and the insulator formed on the other side of the metal substrate are extended to inside the pierced holes. The joining surface between the extended portions is shifted off the center position of the metal substrate in the thickness direction, toward the same side as where the protrusions are formed. In order to electrically connect the wiring pattern layers, a conductor layer connecting the wiring layers is formed through the metal substrate via the pierced holes, thereby establishing conduction between the wiring layers. A semiconductor chip is connected directly to the top side of the circuit board via solder balls.
AbstractList A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has the circuit board in which a metal substrate having pierced holes is formed as a core member. Protrusions are formed at the top ends of the pierced holes, and round corners are formed at the bottom ends of the same. Insulating layers are formed on both sides of the metal substrate, and wiring pattern layers are formed on the respective insulating layers. The insulator formed on one side of the metal substrate and the insulator formed on the other side of the metal substrate are extended to inside the pierced holes. The joining surface between the extended portions is shifted off the center position of the metal substrate in the thickness direction, toward the same side as where the protrusions are formed. In order to electrically connect the wiring pattern layers, a conductor layer connecting the wiring layers is formed through the metal substrate via the pierced holes, thereby establishing conduction between the wiring layers. A semiconductor chip is connected directly to the top side of the circuit board via solder balls.
Author USUI RYOSUKE
SHIBATA KIYOSHI
Author_xml – fullname: USUI RYOSUKE
– fullname: SHIBATA KIYOSHI
BookMark eNrjYmDJy89L5WQwcs4sSi7NLFFIyk8sSlFIzEtRSIaKJBYUJBYllpQWK5QWZ-alK5RkpCoUJ-am8jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMDcwMTE0tLS0dDY-JUAQBmmi6i
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2007044999A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2007044999A13
IEDL.DBID EVB
IngestDate Fri Jul 19 16:03:44 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2007044999A13
Notes Application Number: US20060511496
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070301&DB=EPODOC&CC=US&NR=2007044999A1
ParticipantIDs epo_espacenet_US2007044999A1
PublicationCentury 2000
PublicationDate 20070301
PublicationDateYYYYMMDD 2007-03-01
PublicationDate_xml – month: 03
  year: 2007
  text: 20070301
  day: 01
PublicationDecade 2000
PublicationYear 2007
Score 2.6719916
Snippet A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SWITCHES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RELAYS
SELECTORS
Title Circuit board and circuit apparatus using the same
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070301&DB=EPODOC&locale=&CC=US&NR=2007044999A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD6MKeqbTsXLlIDSt6KusWsfiri0ZQi74FbZ20iyVAralrXFv2-StbqnvYUTyOUkJ-eSky8A9_1HN7YUFKLSjiYWbmxS3ONmzGzscqoQvVS8YzS2hxF-WzwvWvDVvIXROKE_GhxRShSX8l7q8zr_D2L5OreyeGCJJGUv4dzzjcY7Vvv3yfAHXjCd-BNiEOJFM2P8vqnDyrx_lb7SnjSkHZUAGHwM1LuUfFuphMewP5XtpeUJtETagUPS_L3WgYNRfeUti7X0FafQI8maV0mJWCbXFdF0hXhNobnG8K4KpBLZP5E061BBv8UZ3IXBnAxN2fnyb67LaLY9Uusc2mmWigtAMV9xqy8UmgrGlmMzh-LY5bZwVoxJZl9Cd1dLV7urr-FoE7RUyVVdaJfrStxIbVuyW82kX67dgmQ
link.rule.ids 230,309,786,891,25585,76894
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD6MKc43nYqXqQGlb0VdY7c-FHFpS9XdcKvsbSRZKgNtx9rh3zfJWt3T3sIJ5HKSk3PJyReA29a9E1sKClFpRxMLJzYpbnIzZjZ2OFWIXire0evbYYRfJ4-TCnyVb2E0TuiPBkeUEsWlvOf6vF78B7E8nVuZ3bG5JKVPwdj1jNI7Vvv3wfA6rj8ceANiEOJGI6P_vq7Dyrx_lr7SjjSyHYW073901LuUxaZSCQ5gdyjbS_JDqIikDjVS_r1Wh71eceUti4X0ZUfQJPMlX81zxFK5rogmM8QLCl1oDO9VhlQi-yeSZh3K6Lc4hpvAH5PQlJ1P_-Y6jUabI7VOoJqkiTgFFPMZt1pCoalgbLVt1qY4drgt2jPGJLPPoLGtpfPt1ddQC8e97rT70n-7gP11AFMlWjWgmi9X4lJq3pxdaYb9AvfnhVc
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Circuit+board+and+circuit+apparatus+using+the+same&rft.inventor=USUI+RYOSUKE&rft.inventor=SHIBATA+KIYOSHI&rft.date=2007-03-01&rft.externalDBID=A1&rft.externalDocID=US2007044999A1