SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURE THEREOF

• Main Authors: LEE JUIUNG, LIN CHIH-WEN, TSAI CHEN-JUNG
• Format: Patent
• Language: English
• Published: 25.01.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor packaging device comprises a carrier having at least a cavity/a slot thereon, at least a chip has a back surface and an active surface with a plurality of first bonding pads. The chip is affixed to the cavity to expose the active surface. A first insulating layer is on the active sur...