Vapor deposition of dissimilar materials

A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body a...

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Main Authors MEMMEN ROBERT L, SERHIYENKO GREGORY A, RUTZ DAVID A, BELOUSOV IGOR V, KINSTLER MONIKA D, SHELKOVOY EVGENIY A, SHELKOVOI ANATOLI N, MALASHENKO IGOR S
Format Patent
LanguageEnglish
Published 18.05.2006
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Abstract A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body and from the molten body to the substrate as a vapor flow. An essentially non-expending portion of the molten body comprises an alloy having a melting temperature below a melting temperature of the first material.
AbstractList A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body and from the molten body to the substrate as a vapor flow. An essentially non-expending portion of the molten body comprises an alloy having a melting temperature below a melting temperature of the first material.
Author MALASHENKO IGOR S
MEMMEN ROBERT L
KINSTLER MONIKA D
BELOUSOV IGOR V
SERHIYENKO GREGORY A
SHELKOVOY EVGENIY A
RUTZ DAVID A
SHELKOVOI ANATOLI N
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– fullname: SHELKOVOY EVGENIY A
– fullname: SHELKOVOI ANATOLI N
– fullname: MALASHENKO IGOR S
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Snippet A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate...
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SubjectTerms APPARATUS THEREFOR
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
PERFORMING OPERATIONS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SPRAYING OR ATOMISING IN GENERAL
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TRANSPORTING
Title Vapor deposition of dissimilar materials
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