Through-wafer interconnects for photoimager and memory wafers

A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable...

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Main Authors WATKINS CHARLES, HEMBREE DAVID, TUTTLE MARK, VELICKY LU, AKRAM SALMAN, FARNWORTH WARREN, WARK JAMES, KIRBY KYLE, WOOD ALAN, HIATT MARK, RIGG SIDNEY, OLIVER STEVEN
Format Patent
LanguageEnglish
Published 02.03.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
Bibliography:Application Number: US20040932296