Polishing composition

• Main Authors: TAIRA KOUJI, TAKASHINA SHIGEAKI, HONMA YUICHI
• Format: Patent
• Language: English
• Published: 06.10.2005
• Edition: 7
• Subjects: ADHESIVES; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

The present invention relates to a polishing composition containing an abrasive having an average particle size of from 1 to 30 nm and water, wherein the abrasive has a packing ratio of from 79 to 90% by weight; a method for manufacturing a substrate, including the steps of introducing the above pol...