Resin encapsulated semiconductor device and the production method

• Main Authors: SUZUKI KAZUHIRO, IMAMURA HISAYUKI, WATANABE JUNICHI, MORITA TOSHIAKI, CHIBA MITSUAKI
• Format: Patent
• Language: English
• Published: 06.10.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1 a for a resin encapsulated semiconductor module device has a co...