Tri-gate low power device and method for manufacturing the same

The present invention provides a tri-gate lower power device and method for fabricating that tri-gate semiconductor device. The tri-gate device includes a first gate [ 455] located over a high voltage gate dielectric [ 465] within a high voltage region [ 460] , a second gate [ 435] located over a lo...

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Main Authors BREASHEARS EDDIE H, ADAM LAHIR S, TSAO ALWIN J
Format Patent
LanguageEnglish
Published 29.09.2005
Edition7
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Abstract The present invention provides a tri-gate lower power device and method for fabricating that tri-gate semiconductor device. The tri-gate device includes a first gate [ 455] located over a high voltage gate dielectric [ 465] within a high voltage region [ 460] , a second gate [ 435] located over a low voltage gate dielectric [ 445] within a low voltage core region [ 440] and a third gate [ 475] located over an intermediate core oxide [ 485] within an intermediate core region [ 480] . One method of fabrication includes forming a high voltage gate dielectric layer [ 465] over a semiconductor substrate [ 415] , implanting a low dose of nitrogen [ 415 a] into the semiconductor substrate [ 415] in a low voltage core region [ 440] , and forming a core gate dielectric layer [ 445] over the low voltage core region [ 440] , including forming an intermediate core gate dielectric layer [ 485] over an intermediate core region [ 480].
AbstractList The present invention provides a tri-gate lower power device and method for fabricating that tri-gate semiconductor device. The tri-gate device includes a first gate [ 455] located over a high voltage gate dielectric [ 465] within a high voltage region [ 460] , a second gate [ 435] located over a low voltage gate dielectric [ 445] within a low voltage core region [ 440] and a third gate [ 475] located over an intermediate core oxide [ 485] within an intermediate core region [ 480] . One method of fabrication includes forming a high voltage gate dielectric layer [ 465] over a semiconductor substrate [ 415] , implanting a low dose of nitrogen [ 415 a] into the semiconductor substrate [ 415] in a low voltage core region [ 440] , and forming a core gate dielectric layer [ 445] over the low voltage core region [ 440] , including forming an intermediate core gate dielectric layer [ 485] over an intermediate core region [ 480].
Author BREASHEARS EDDIE H
TSAO ALWIN J
ADAM LAHIR S
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Snippet The present invention provides a tri-gate lower power device and method for fabricating that tri-gate semiconductor device. The tri-gate device includes a...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Tri-gate low power device and method for manufacturing the same
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