Circuitized substrate assembly and method of making same
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
20.01.2005
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith. |
---|---|
AbstractList | A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith. |
Author | LAUFFER JOHN M MARKOVICH VOYA R FULLER JAMES W |
Author_xml | – fullname: FULLER JAMES W – fullname: LAUFFER JOHN M – fullname: MARKOVICH VOYA R |
BookMark | eNrjYmDJy89L5WSwcM4sSi7NLMmsSk1RKC5NKi4pSixJVUgsLk7NTcqpVEjMS1HITS3JyE9RyE9TyE3MzsxLVyhOzE3lYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBgamBoaGZuYGjobGxKkCAOYJMP8 |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
Edition | 7 |
ExternalDocumentID | US2005011670A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2005011670A13 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 16:04:26 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2005011670A13 |
Notes | Application Number: US20040915483 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050120&DB=EPODOC&CC=US&NR=2005011670A1 |
ParticipantIDs | epo_espacenet_US2005011670A1 |
PublicationCentury | 2000 |
PublicationDate | 20050120 |
PublicationDateYYYYMMDD | 2005-01-20 |
PublicationDate_xml | – month: 01 year: 2005 text: 20050120 day: 20 |
PublicationDecade | 2000 |
PublicationYear | 2005 |
RelatedCompanies | ENDICOTT INTERCONNECT TECHNOLOGIES, INC |
RelatedCompanies_xml | – name: ENDICOTT INTERCONNECT TECHNOLOGIES, INC |
Score | 2.6092088 |
Snippet | A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
Title | Circuitized substrate assembly and method of making same |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050120&DB=EPODOC&locale=&CC=US&NR=2005011670A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFfWmVbFaZUHJLZg070MQmwdF6APbSG8lm24g0CSlSRH99U7WRHvqbdmFYXbhm8fuzjcAT5bCQoMyWTRjUxPVUDJE2mcKGsPKe0esH3EuvdFYHwbq20JbtGDd1MJwntBPTo6IiIoQ7yW315v_SyyX_60snmmCU_mLP7ddocmOtaoWVHAHtjeduBNHcBw7mAnj93pN1g3pFXOlIwykjQoP3segqkvZ7DsV_xyOpygvKy-gxbIOnDpN77UOnIzqJ28c1ugrLsF0km20S8rkm61IgYjnzLIEw1-W0vUXCbMV-e0ITfKYpLzPFCnClF3Bo-_NnaGIKiz_drwMZvv6KtfQzvKM3QCxVJNWLHA6DU011tVQkdFy6iuTqVGs6VYXeock3R5evoMzzkwqyQieHrTL7Y7do88t6QM_qh_FqoSh |
link.rule.ids | 230,309,783,888,25576,76876 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOKbokYUtYlmb4uMffKwGNlGUNkgAoY3sm5dsoQNwkaM_vXeKlOeeGva5HJt8ruPtvc7gIeOzHydMkk0IkMVFb-li7TNZDSGhfcOWDvgXHqup_WnyutMnVVgUdbCcJ7QT06OiIgKEO85t9er_0ssm_-tzB5pjFPLp97EtIUyO1aLWlDB7prOaGgPLcGyzOlY8N63a5Kmt54xVzrAIFsv8OB8dIu6lNWuU-mdwOEI5aX5KVRYWoeaVfZeq8ORu33yxuEWfdkZGFa8DjZxHn-zkGSIeM4sSzD8ZQldfBE_DclvR2iyjEjC-0yRzE_YOdz3nInVF1GF-d-O59Pxrr7yBVTTZcougXQUgxYscBr1DSXSFF-W0HJqocGUIFK1TgOa-yRd7V--g1p_4g7mgxfv7RqOOUtpS0IgNaGarzfsBv1vTm_5sf0AKfiHlA |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Circuitized+substrate+assembly+and+method+of+making+same&rft.inventor=FULLER+JAMES+W&rft.inventor=LAUFFER+JOHN+M&rft.inventor=MARKOVICH+VOYA+R&rft.date=2005-01-20&rft.externalDBID=A1&rft.externalDocID=US2005011670A1 |