Apparatus and method for supplying chemicals in chemical mechanical polishing systems

An apparatus for supplying chemicals in a chemical mechanical polishing (CMP) process includes a plurality of chemical solution supply sources for supplying different chemical solutions in a pump-less manner by using a pressure applied at the chemical solution supply sources, each supply source havi...

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Bibliographic Details
Main Authors KIM SUE-RYEON, CHAE SEUNG-KI, KIM SEUNG-UN, LEE JE-GU
Format Patent
LanguageEnglish
Published 09.09.2004
Edition7
Subjects
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