Film thichness measuring monitor wafer

• Main Authors: SAITO MAKOTO, FUJITA FUSAO, EBATA MAKOTO
• Format: Patent
• Language: English
• Published: 08.04.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The object of the present invention is to provide a wafer having a structure of enabling an SiC wafer to be put to practical use as a wafer for monitoring a film thickness. For this purpose, an average surface roughness Ra of at least one surface of the SiC wafer is set to be substantially equivalen...