Structure and method for testing of PIC with an upturned mirror

• Main Authors: Yang, Jing, Venkatesan, Suresh, Soldano, Lucas, Lee, Yong Meng
• Format: Patent
• Language: English
• Published: 01.10.2024
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; TESTING

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits...