Antistatic resin composition comprising thermoplastic resin and conductive filler

Provided is an antistatic resin composition, which includes: a thermoplastic resin including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer and thermoplastic polyurethane (TPU); and a conductive filler including carbon nanotubes. A molded article manufactu...

Full description

Saved in:
Bibliographic Details
Main Authors Jang, Hye Won, Kim, Gwan Yeong, Kang, Kyu Hyun
Format Patent
LanguageEnglish
Published 01.10.2024
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online AccessGet full text

Cover

More Information
Summary:Provided is an antistatic resin composition, which includes: a thermoplastic resin including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer and thermoplastic polyurethane (TPU); and a conductive filler including carbon nanotubes. A molded article manufactured using the composition of the present invention has the advantage of improved tensile strength, impact resistance, and surface resistance.
Bibliography:Application Number: US202117761355