Shape-memory alloy lock for connectors

A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an...

Full description

Saved in:
Bibliographic Details
Main Authors Bielick, James D, Lewis, Theron Lee, Hugo, Stephen Michael, Bennett, Jennifer I, Dangler, John R, Braun, David J, Younger, Timothy P, Jennings, Timothy
Format Patent
LanguageEnglish
Published 24.09.2024
Subjects
Online AccessGet full text

Cover

Loading…
Abstract A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.
AbstractList A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.
Author Braun, David J
Dangler, John R
Bennett, Jennifer I
Hugo, Stephen Michael
Jennings, Timothy
Bielick, James D
Lewis, Theron Lee
Younger, Timothy P
Author_xml – fullname: Bielick, James D
– fullname: Lewis, Theron Lee
– fullname: Hugo, Stephen Michael
– fullname: Bennett, Jennifer I
– fullname: Dangler, John R
– fullname: Braun, David J
– fullname: Younger, Timothy P
– fullname: Jennings, Timothy
BookMark eNrjYmDJy89L5WRQC85ILEjVzU3NzS-qVEjMycmvVMjJT85WSMsvUkjOz8tLTS7JLyrmYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGRoYGBpaGBk5GxsSoAQBX6ilh
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US12100910B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US12100910B23
IEDL.DBID EVB
IngestDate Fri Oct 11 05:30:39 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US12100910B23
Notes Application Number: US202117457737
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240924&DB=EPODOC&CC=US&NR=12100910B2
ParticipantIDs epo_espacenet_US12100910B2
PublicationCentury 2000
PublicationDate 20240924
PublicationDateYYYYMMDD 2024-09-24
PublicationDate_xml – month: 09
  year: 2024
  text: 20240924
  day: 24
PublicationDecade 2020
PublicationYear 2024
RelatedCompanies INTERNATIONAL BUSINESS MACHINES CORPORATION
RelatedCompanies_xml – name: INTERNATIONAL BUSINESS MACHINES CORPORATION
Score 3.5741851
Snippet A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
Title Shape-memory alloy lock for connectors
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240924&DB=EPODOC&locale=&CC=US&NR=12100910B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LSwMxEB5KFfWmVdH6IILsLYjZ3bgeFmFfFKEP3K70VrIxwSrWxa5I_72TsLVe9BYSyGNg8s1kZr4AXKKXoZj2n6jwmaaGv5wKziQViC3c1Z53Y4vC-gPeK7z7iT9pwcuqFsbyhH5ZckTUKIn6Xtv7ulo_YiU2t3JxVc6w6_0uG4eJ03jHCE_oTzhJFKajYTKMnTgOi9wZPISGJ8tAY4TX9YYxow3PfvoYmaqU6jekZLuwOcLZ5vUetNS8A9vx6ue1Dmz1m4A3NhvdW-yDkz-LStE3kxq7JCZeviSIRK8EzU4iTb6K_TnnAC6ydBz3KC44_TndtMjXe3MPoY1evzoC4vOSa8bQIPKYJ2Vwq0WghOteK60kU8ExdP-ep_vf4AnsGElRG1o5hXb98anOEFnr8tyK5BsF93wh
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTkXnVwXpWxDTj9WHIrRdqbp2w7ayt9LGBD9wDleR_fdeQud80beQQD4OLr-73N0vAOfoZXAqrEdSWlQQyV9OSpsyUiK22IYwzb4qCosTO8rN24k1acHLshZG8YR-KXJE1CiG-l6r-3q2esQKVG7l_KJ6xq736zBzA73xjhGe0J_QA88djEfByNd9381TPbl3JU-WhEYPr-u1vmTnlabTgyerUma_ISXcgvUxzjatt6HFp13o-Muf17qwETcBb2w2ujffAT19KmecvMnU2IUm4-ULDZHoVUOzU2MyX0X9nLMLZ-Eg8yOCCxY_pyvydLU3Yw_a6PXzfdAsu7IFpWgQmdRkzLkSpcNLw7jkgjPKnQPo_T1P77_BU-hEWTwshjfJ3SFsSqkRFWY5gnb98cmPEWXr6kSJ5xv7yH8O
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Shape-memory+alloy+lock+for+connectors&rft.inventor=Bielick%2C+James+D&rft.inventor=Lewis%2C+Theron+Lee&rft.inventor=Hugo%2C+Stephen+Michael&rft.inventor=Bennett%2C+Jennifer+I&rft.inventor=Dangler%2C+John+R&rft.inventor=Braun%2C+David+J&rft.inventor=Younger%2C+Timothy+P&rft.inventor=Jennings%2C+Timothy&rft.date=2024-09-24&rft.externalDBID=B2&rft.externalDocID=US12100910B2