Cooling apparatus
A cooling apparatus includes a base plate configured to dissipate heat, a top plate coupled to the base plate, the top plate includes a second opening positioned above the heat exchange chamber, a cover coupled to the base plate, the cover and the base plate defining a heat exchange chamber, the cov...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
24.09.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A cooling apparatus includes a base plate configured to dissipate heat, a top plate coupled to the base plate, the top plate includes a second opening positioned above the heat exchange chamber, a cover coupled to the base plate, the cover and the base plate defining a heat exchange chamber, the cover is over the second opening, the cover includes a first opening and a third opening defined adjacent to the first opening, the first opening and the third opening positioned above the heat exchange chamber, the first opening in fluid communication with the heat exchange chamber through the second opening, and a pumping unit disposed on the base plate, the pumping unit is over the first opening and the third opening, the pumping unit configured to circulate fluid into and out of the heat exchange chamber. |
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| AbstractList | A cooling apparatus includes a base plate configured to dissipate heat, a top plate coupled to the base plate, the top plate includes a second opening positioned above the heat exchange chamber, a cover coupled to the base plate, the cover and the base plate defining a heat exchange chamber, the cover is over the second opening, the cover includes a first opening and a third opening defined adjacent to the first opening, the first opening and the third opening positioned above the heat exchange chamber, the first opening in fluid communication with the heat exchange chamber through the second opening, and a pumping unit disposed on the base plate, the pumping unit is over the first opening and the third opening, the pumping unit configured to circulate fluid into and out of the heat exchange chamber. |
| Author | Lin, Tsung Wei Tsai, Shui Fa |
| Author_xml | – fullname: Lin, Tsung Wei – fullname: Tsai, Shui Fa |
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| Notes | Application Number: US202217728639 |
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| PublicationYear | 2024 |
| RelatedCompanies | COOLER MASTER CO., LTD |
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| Snippet | A cooling apparatus includes a base plate configured to dissipate heat, a top plate coupled to the base plate, the top plate includes a second opening... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES |
| Title | Cooling apparatus |
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