Molding device and molding method

• Main Authors: Yeh, Liang-Hui, Chen, Ching-Hao
• Format: Patent
• Language: English
• Published: 24.09.2024
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A molding device includes a mold cavity defined by an upper mold, a lower mold and a middle mold being moveably attached to the lower mold; a position control mechanism configured to move the middle mold; and a gas discharging mechanism disposed adjacent to the mold cavity and including a gas conduit and a slit jointly defined by the upper mold and the lower mold when the molding device is closed, the slit is in communication with the mold cavity and the gas conduit. A molding method includes injecting a material into a mold cavity to form an article in the mold cavity; discharging at least a portion of a gas out of the mold cavity through a slit of a gas discharging mechanism adjacent to the mold cavity after the article is formed; disengaging a upper mold from a lower mold; and detaching the article from a middle mold.